Developing radio communication components and systems can be quite challenging. Over the few last decades there has been a lot of effort in development to follow the trend of miniaturizing and to comply with the growing demand in terms of functionality. Alongside that, the diversity of electrical designs and materials has become a bigger issue when looking at product development cycles and costs.
At Leap we are aware of the complexity of these problems. We can offer our expertise as well as a range of tools to study emitted interferences and the immunity to interferences on a single component, high complex multilayer PCB and large arrangements involving the environment, humans and vehicles. With our simulation tools your engineer will be aware of critical EMC/EMI parameters of the device from the beginning of the development process. This makes it easier to plan counteractions early which are fundamental for passing the final test in the anechoic chamber.
Leap has the answer to tackle the problems in modern HF device and system development. Our best in class Simulation Software covers the full range of 2D, 2.5D and full-wave 3D electromagnetic analysis for any type of application. We have a wide range of customers all over Australia in the areas of aerospace and defense, automotive, consumer electronics and microwave components.
Challenges, Solutions and Benefits
- EMC/EMI
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EMC/EMI (Electromagnetic Compatibility/ Electromagnetic Interferences)
Merging electronic systems and components leads to higher package densities. Requirements related to efficiency (not only in mobile devices) require lower power levels. Small distances and low power levels of digital and analogue signals are easily influenced by cross talking. EMC/EMI has become a big issue in all industries and a major part in the product development process.
- SI Signal Integrity
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Transmitting high bit rates over long traces often leads to problems in Signal Integrity (SI). We are using a range of tools to solve those problems on various arrangements:
- Printed Circuit Boards (PCBs)
- Ball Grid Arrays (BGAs)
- Multi-Chip Modules (MCMs)
Some of those simulations are done by SPICE driven engine tools. 2D Tools allow us to extract the field distributions from transmission lines and connector cross sections. In addition to this, we use full wave 3D tools to analyse three dimensional interconnects in terms of crosstalk between wires, conductors and vias.
- Multiphysic Aspects - RF Analsyis
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The modern RF engineers main interest is the electrical behaviour of the device. However, due to the trend of miniaturizing many RF developers are facing thermal and mechanical issues. Over the last few years we see a higher demand in a full product analysis starting in the area of RF and subsequently touching different physics.
Our High Frequency Simulation Software allows coupling into the markets leading FEM system which is ANSYS Workbench. Thus, manufacturing and assembling issues can also be solved side by side in the beginning when calculating the HF characteristics; especially in the areas of packaging, integrated circuits and connecting techniques that benefit from this.
Thermal and fluid flow analysis can be attached after the full wave 3D solver calculated the Joule Losses. The Link is dynamic. The Temperature information can be passed back into the full wave 3D solver.
- LEAP Products
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