No products in the cart.

Menu
Home / ANSYS2019

ANSYS2019

ANSYS 2019 R3 is now available and can be downloaded from the ANSYS Customer portal

We will update this page with release information as it becomes available including on-demand videos showcasing new product features.  Please complete this form if you would like to be notified by email when new video content is available.

Watch our summary of ANSYS 2019 R3 key enhancements by clicking below or watch summaries of previous 2019 releases and our live product updates from CONVERGE 2019 here.

ANSYS is making simulation even more pervasive through the ease of use and new functionalities of its newly released ANSYS 2019 R3. From a revolutionary user experience in ANSYS Fluent to hyper-accurate additive manufacturing solutions to the introduction of groundbreaking capabilities in the new ANSYS Motion product line, ANSYS 2019 R3 enables engineers at every level to develop the most innovative products across a multitude of industries.

ANSYS Fluent’s task-based workflow enable users to quickly and easily create high quality Mosaic-enabled meshes, even for complex geometries.

Megatrends like 5G, autonomous vehicles and electrification are radically changing the product development landscape, making it difficult for companies to retain engineers who can keep pace. The new capabilities across ANSYS’ entire simulation portfolio empower engineers, regardless of level of expertise, to simulate from beginning to end faster and more intuitively, maximizing their productivity.

“ANSYS’ multiphysics solutions enable engineers to keep pace with increasing demands despite decreasing budgets, training and timelines,” said Shane Emswiler, vice president and general manager for ANSYS electronics, fluids and mechanical business units at ANSYS. “With the unparalleled improvements in ANSYS 2019 R2, ANSYS ushers in the next generation of Pervasive Engineering Simulation and enables engineers at every level to adopt simulation more seamlessly across the entire product lifecycle.”

With ANSYS 2019 R3, engineers can iterate concepts, simulate results and validate designs faster and easier without sacrificing power or accuracy.

 

Highlights of the 2019 R3 release include:

3D Design

ANSYS Discovery Live introduces the first-ever, interactive topology optimization tool for generative design, as well as new simulation functionality, including mass flow outlets and time varying inputs for transient studies. With these enhancements, you can easily evaluate a broad spectrum of product behaviors and uncover optimal design solutions in record time.

Additions to ANSYS Discovery SpaceClaim include automatic surface reconstruction from faceted geometry, such as STL. This process converts triangle-based models into smooth watertight CAD models for reverse engineering and generative design workflows. Visualization improvements produce higher-quality renderings for an enhanced user experience.

In ANSYS Discovery AIM, you will now find support for structural beams, physics-aware meshing enhancements and linear buckling capabilities. The release offers more proven, easy-to-use functionality — from mesh failure visualization to structural stability evaluation — than ever before.

Additive Manufacturing

ANSYS Additive Prep has a new build processor: You can now export a build file directly to an additive manufacturing (AM) machine.

ANSYS Workbench Additive enables toggling between the STL supports, meshes and element densities. It includes an option (in the AM process sequencer) for removing the STL supports after cooldown.

ANSYS Additive Print offers new support-related features:

  • The support-only cutoff feature helps you cut the support from the part — without separating the part from the baseplate under the displacement.
  • The support groups feature accounts for multiple support types (volume-less, solid) in a single simulation.

Electromagnetics

ANSYS 2019 R3 delivers electromagnetic field simulation solutions to aid our customers’ pursuit of the engineering megatrends of autonomy, 5G connectivity and electrification. New features include:

  • Expansion of ANSYS Cloud offering to ANSYS Electronic Desktop — users of ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor can now benefit from high-performance computing options available in ANSYS Cloud.
  • ANSYS HFSS receives significant upgrade in distributed memory solver speed.
  • ANSYS HFSS and ANSYS HFSS SBR+ include new capabilities for modeling and post-processing complex radar cross section scenarios required for autonomous system simulation.
  • Creeping wave physics has been added to ANSYS HFSS SBR+, a significant new capability to accurately predict radar cross section of large targets with curvatures.
  • Dramatic speed improvements for simulating IC packages and PCB’s with the HFSS regions in SIwave hybrid solution — HFSS regions can now be distributed across compute resources and solved in parallel.

Embedded Software

In ANSYS 2019 R3, the capabilities of the embedded software family have been enhanced and extended to help you drive your initiatives around autonomous vehicles.

ANSYS solutions address all key elements of autonomous vehicles (AV): sensors, human-machine interfaces, automated driving software, control software, computing platform and vehicle platform. In addition to existing solutions, this release introduces a brand-new product dedicated to testing and safety of AI-based AV embedded perception software: ANSYS SCADE Vision. SCADE Vision speeds the discovery of weaknesses in your AV embedded perception software, while drastically reducing costs of testing and safety verification, making every mile count, and deriving maximum value from your AV data.

ANSYS SCADE enhances important features required for developing the most advanced automotive systems and the embedded software that controls those systems, including AV. The unique combination of a complete and efficient AUTOSAR SWC flow with SCADE and the ability to seamlessly import large Simulink® models enables you to re-use the legacy models produced by system engineering teams. With SCADE, you benefit from the unmatched, highest-quality ISO 26262 certified code generation toolchain.

Fluids

This release advances the new ANSYS Fluent user experience. For example, you can now use Mosaic-enabled meshes to run parametric studies in ANSYS Workbench, and apply fault-tolerant meshes to support nonconformal interfaces when simulating conjugate heat transfer. Plus, the Fluent expression language capability is newly available for use with parameters, reports and monitors.

Numerous other important updates and additions augment your computational fluid dynamics (CFD) analyses over a broader range of applications:

  • An automated workflow accelerates the Fluent adjoint solver and generates an organic, optimal shape for multiple objectives and operating conditions.
  • Fluent more quickly and easily evaluates complex reduced-order models (ROMs) for improved design exploration.
  • ANSYS Forte can be combined with Fluent or ANSYS Mechanical for more accurate, conjugate heat transfer analysis.

Materials

This release introduces ANSYS GRANTA Selector. Based on 25 years of materials selection technology embodied in the earlier CES Selector products, the new Selector offers a refreshed look, great new features and integration with ANSYS products. It facilitates smart materials choices through a comprehensive materials data library and a series of tools for filtering, analyzing and applying the data. It delivers optimized data for comparisons, equivalency studies and selection of metal grades, improved support for simulation and an enhanced user experience.

ANSYS GRANTA Materials Data for Simulation is now accessible through ANSYS Electronics Desktop for electromagnetics simulation. The latest release extends coverage to include key electromagnetic properties, along with mechanical and thermal properties. With 700-plus records across many important materials classes, the materials database minimizes data search and conversion time. The same enlarged dataset is available in ANSYS Mechanical.

Optical

This release further integrates optical simulation into the ANSYS environment. ANSYS SPEOS now includes meshed geometry support — which enables mesh data import from the multiphysics workflow — and head-up display (HUD) optical design, which generates the optimal layout and shapes for the best driver experience.

SPEOS Live Preview offers more flexibility and ease of use. With one click, you can switch between true and false color, adjust the scale adaptation to fit with the results preview, select the sensor type for preview and much more.

Also added is the SPEOS Road Library for Sensors Simulation. It contains retro-reflecting materials — asphalt, signs, paint, vegetation, etc. — which can be detected by any sensor.

The release introduces new ambient and thermal source models for more realistic simulations of sky and sun environments. And, with a new feature for simulating rotating lidar, SPEOS facilitates quick field-of-view studies.

SPEOS also delivers a more intuitive interface for an improved user experience.

Platform

You can slash hours or days off your simulation runtimes and increase the size and fidelity of your models by unlocking nearly unlimited compute capacity with ANSYS Cloud. Built upon the highly secure Microsoft® Azure™ platform, ANSYS Cloud provides easy access to on-demand compute cores directly from ANSYS Mechanical, ANSYS Fluent and ANSYS Electronics Desktop. New with this release, ANSYS Maxwell users can now take advantage of this secure compute platform by selecting from preconfigured high-performance computing (HPC) configurations, which have been optimized to provide the best performance-to-cost ratio for their electromechanical applications.

In addition, ANSYS 2019 R3 introduces a true multiphysics collaboration offering. ANSYS Minerva , powered by Aras’ resilient platform, is a centralized simulation knowledge management application that stores data, project plans and analytics for easy accessibility by team members across geographies and functional silos. By providing a single, centralized repository of critical simulation expertise, Minerva can help you deliver your next-generation products to market faster and at lower development costs.

Semiconductors

The ANSYS semiconductor portfolio of power efficiency, power integrity and reliability solutions achieves ISO 26262 “Tool Confidence Level 1” (TCL1) certification. This certification enables automotive integrated circuit (IC) designers to meet rigorous safety requirements for ADAS and autonomous applications.

Auto chip makers can leverage ANSYS PowerArtist, ANSYS Totem and ANSYS RedHawk family of multiphysics simulations for all ISO 26262 safety-related development projects at any Automotive Safety Integrity Level. Next-generation system-on-chip (SoC) solutions for automotive, artificial intelligence (AI) and 5G applications are facing shrinking design margins along with increasing cost and time-to-market pressures. ANSYS RedHawk-SC can solve these problems by addressing complex multiphysics challenges in these designs that use advanced FinFET processes and 3D-IC packaging technologies. RedHawk-SC in ANSYS 2019 R3 will include major foundry certifications for a comprehensive list of FinFET nodes down to 5nm, significant performance improvement for self-heat and thermal-aware electromigration analysis and orders-of-magnitude reduction in runtime for effective resistance calculation.

Structures

Innovations to ANSYS structural solutions in ANSYS 2019 R3 enable you to:

  • Study large assembly models with millions of degrees of freedom with ANSYS Motion, an advanced multibody dynamic solver now integrated into ANSYS Mechanical.
  • Quickly and accurately predict product failure early in the design stage for electronic hardware at the component, board and system levels with the addition of ANSYS Sherlock.
  • Translate electronic computer-aided design (ECAD) models into finite element analysis (FEA) geometries in minutes and build on FEA information to predict time to failure.
  • Evaluate multiple design variations to scale by running tens of thousands of design points spread across clusters, networks, and operating systems with distributed compute services (DCS) — a new family of applications to distribute, manage, solve and optimize design challenges on a variety of compute resources.
  • Simulate tightly coupled thermal and structural field analysis with two new streamlined workflows in Mechanical. Easily capture the interaction of thermal and structural loads with static and transient simulations.
  • Perform inverse analyses with Mechanical. The inverse solver can determine the shape of a model prior to extreme loads and deformation — sometimes referred to as “hot-to-cold” analysis.
  • Benefit from 120 additional materials within Mechanical from the ANSYS GRANTA Materials Data for Simulation database, including electromagnetic properties data where appropriate.

Systems

ANSYS 2019 R3 updates make it quicker and easier for you to build, validate and deploy simulation-based digital twins for predictive maintenance in ANSYS Twin Builder to optimize your product’s operation and extends its lifetime. Electrification-specific enhancements to Twin Builder enable you to better simulate battery management systems and deploy digital twins for other electrification applications. Additional advances in this release include Modelica enhancements, new reduced-order model (ROM) capabilities and an improved electronics control module (ECM) toolkit.

ANSYS medini analyze extends its functional safety analysis expertise beyond automotive and aerospace to industrial equipment requiring IEC 61508 standardization. It includes consistent safety integrity level (SIL) management covering process hazard analysis (PHA), systems requirements and system design. Failure modes, effects and diagnostic analysis (FMEDA) with safe failure fraction (SFF) and diagnostic coverage (DC) computations are also covered.

The release includes innovative sensor and sound simulations in ANSYS VRXPERIENCE as well as new capabilities in virtual reality (VR), providing a software-in-the-loop connector from the HMI. VRXPERIENCE now includes multi-bounce ray casting in the ideal ground-truth sensor; flashing and rotating models of physics-based lidar; and a dynamic live preview enabling geometry movement during SPEOS Live Preview. ANSYS SCADE Suite and SCADE Display integration makes it easy to interact with your embedded software in VR.

 

Highlights of the 2019 R1 & R2 releases include:

New Mechanical User Experience

With ANSYS 2019 R2 and the acquisition of DfR Solutions, ANSYS Mechanical cements its industry lead in usability and productivity. ANSYS 2019 R2 introduces a new user interface in ANSYS Mechanical that speeds user adoption and reduces learning times to transform engineers’ productivity. The improved interface provides new capabilities around customization, ease of use features and instant search and launch tool.

By adding DfR Solutions’ Sherlock to the portfolio, ANSYS now offers a turnkey, end-to-end solution in electronics reliability.

“The recent acquisition of DfR Solutions provides users an easy-to-use solution focused on mechanical reliability for electronic products,” said Jim Hunter, manager, Viasat Reliability Engineering. “Electronic product CAD assemblies which previously took weeks to create can now be assembled and solved in under an hour.”

Beyond the new interface and acquisition, 2019 R2 includes enhanced SMART fracture modeling, a new topology optimization methodology that reduces the time to prepare the resultant geometry—shortening the digital thread. Also included in ANSYS 2019 R2 is an automatic meshed-based connection for shell and beam models, which is a key offering for oil & gas structures and heavy industrial equipment models.

“ANSYS’ meshed-based connection enabled us to generate meshes for models and complicated geometries previously impossible to mesh. Days spent ensuring joint edges were properly imprinted on faces geometrically are now in the past, as the meshed-based connection technology automatically detected and connected the model exactly as intended. By every metric, the mesh quality was superior to previously meshed models,” said Wu Zhu, Principal Structural Engineer at Diamond Offshore Drilling. “Diamond Offshore Drilling’s mission of responsibly unlocking energy depends on our in-house engineering team swiftly responding to environmental and customer needs. Not only will this new meshing technology save us hours of tedious geometry work, it will allow us to respond to urgent FEA tasks faster.”

New Materials Offerings

Following the acquisition of Granta, ANSYS 2019 R2 embeds data on more than 600 materials within ANSYS Mechanical — speeding up the process of setting up models by reducing time spent looking for material properties. The ANSYS GRANTA Materials Data for Simulation data package provides broad coverage of material types and easy access to key data needed for structural analysis.

Powerful New Tools for Simulating Complex Electronics

New offerings in the electronics and electromagnetics suite include important new features for engineers meeting complex design challenges. Accelerated doppler processing in ANSYS® HFSS™ SBR+ expedites the modeling of ADAS radar scenarios related to autonomous vehicles and other near-field radar sensing systems by 100X.

ANSYS 2019 R2 also introduces TAU Flex meshing, a powerful new meshing technology enabling users to efficiently obtain design trend information earlier in the design cycle. The integration of EMIT to the ANSYS HF flow enables a new capability to simulate RF Desense, a major challenge encountered by engineers designing smartphones, tablets and wireless products that include antennas, RF transceivers, digital data sources and sensors.

Additionally, in collaboration with our partner Modelithics, Inc., ANSYS 2019 R2 introduces a new library of HFSS 3D component models for the design of 5G and wireless communication systems.

ANSYS Cloud added to Electronics Suite

ANSYS Cloud delivers easy and instantaneous access to cloud-based high-performance computing directly within ANSYS’ structures, fluids and electronics product suites — enabling companies of all sizes to accelerate their digital transformation initiatives with near infinite compute resources, more product performance data and faster time to market. Direct on-demand cloud access from the ANSYS® Electronics Desktop™ in 2019 R2 enables ANSYS® HFSS™ and ANSYS® SIwave™ customers to seamlessly burst into faster, distributed simulation—solving higher fidelity models and more design variations well beyond the capacity of their on-premise compute resources.

New Fluids Workflow Speeds Meshing of Dirty Geometries

In the fluids suite, ANSYS enhanced and extended its new Fluent experience that accelerates digital transformation by enabling users to do more computational fluid dynamics (CFD), in less time, with less training than ever before. The new task-based, fault tolerant workflow meshes dirty, non-watertight geometries twice as fast without scripts or popups. Complex models that previously took days or even weeks can now be meshed in hours.

With ANSYS 2019 R2, users can further speed combustion simulations without sacrificing accuracy through the newly released capabilities. A benchmark example resulted in a reduced mechanism with 36% fewer species than previous methods. Parallel performance gains can cut simulation time in half for full-cycle internal combustion engine simulations that include spray, chemistry and flame propagation physics.

New hybrid meshing capabilities save hours of hands-on time by enabling users to completely mesh complex turbine blade models.

New SPEOS with Live Preview

The new ANSYS SPEOS packages an unprecedented integration that offers an intuitive and comprehensive user interface — increasing customers’ productivity by computing GPU-based simulation previews within the ANSYS multiphysics ecosystem. The new ANSYS SPEOS enables a faster and more iterative design potential and is accessible to engineers without computer-aided design (CAD) experience.

With the new SPEOS Live Preview, users explore an interactive version of their SPEOS simulation model and obtain immediate rendering results directly on ANSYS VRXPERIENCE.

“To develop successful head-up display systems, Hyundai Mobis must simultaneously assess the highly complex optical and mechanical performance of many different designs,” said Kihyuk Song, Principal Research Engineer, Hyundai Mobis. “With ANSYS SPEOS, we can rapidly test many scenarios to determine the optimal HUD configuration, while reducing our development times.

Revolutionary ANSYS VRXPERIENCE Offerings

The new ANSYS VRXPERIENCE Sound empowers users to improve brand image and the sound quality by listening and modifying the sound coming from a recording or CAE. ANSYS VRXPERIENCE Sound is the premier software and comprehensive solution for sound analysis, sound quality measurement and 3D playback, and is now connected to ANSYS Mechanical.

With the ANSYS 2019 R2 release, ANSYS VRXPERIENCE HMI and ANSYS VRXPERIENCE Perceived Quality enable users to more easily define object animation and lighting approach through finger tracking — creating dynamic and interactive projects faster. Users can easily animate and experiment with virtual prototypes.

Complete Driving Simulation Platform

ANSYS 2019 R2 offers advanced simulation of scenarios for closed loop ADAS and AV testing with its new complete driving simulation platform, ANSYS VRXPERIENCE Driving Simulator Powered by SCANeR™. Users can virtually test scenarios in direct connection with ANSYS VRXPERIENCE.

ANSYS VRXPERIENCE Driving Simulator Powered by SCANeR provides the capability to prepare advanced scenarios and run simulations including events, surrounding traffic and vehicle dynamic with complete and accurate multi-body vehicle dynamics. With ANSYS VRXPERIENCE Driving Simulator Powered by SCANeR, users will reduce physical testing and shorten the time to market by testing the autonomous driving systems in a digital framework.

Streamlined Safety Testing and Analysis

With the ANSYS® medini analyze and SCADE® families, users are enabled with new capabilities that allow them to ensure the digital safety of their embedded systems and software applications. The new ANSYS® SCADE® Test™ model coverage feature divides the testing effort relative to structural coverage achievement — thanks to model-to-code coverage. Unique in the embedded software market space, model-to-code coverage requires only one execution, one acquisition, one level of justification and one review. The software is also 10X faster than previous versions.

ANSYS SCADE Test for SCADE Suite® is ready for qualification under DO-178C and for certification under ISO 26262, IEC 61508, or EN 50128. The resulting qualification credits enable users to avoid lengthy and costly reviews and verification activities when certifying and qualifying their safety-critical products.

The innovations in SCADE® Solutions for ARINC 661 Compliant Applications provide users with up to 40% efficiency improvement in widget and graphical server creation, thanks to the new ARINC 661 Server Creator UI. This user interface allows for a streamlined ARINC 661 widget and server creation and customization process.

“Rail-Mil is currently developing the first communication-based train control system for Poland and has chosen ANSYS to help deliver on this business initiative. This project is aimed at increasing railway system capacity while maintaining existing safety levels,” said Slawomir Jasinski, CEO, Rail-Mil Poland. As we develop onboard systems for trains, the intelligent solutions we use have to be reliable and safe, as any issue could lead to serious consequences. We selected ANSYS SCADE as it is the best software in the market to speed up embedded software development and ensure compliance with EU regulations.”

ANSYS® medini analyze fully supports the FMEDA safety analysis on the semiconductor level including verification of safety mechanism coverage data by fault injection. This enables our customers to comply with ISO 26262:11 2018.

New Features for System Simulation and Digital Twins

ANSYS® Twin Builder™ 2019 R2 enhances Modelica workflow capabilities, making it easier for users to quickly implement and edit Modelica components in their systems designs. Support for undo-redo and a new array connector dialog box are a few of these new capabilities. New solver performance enhancements in the product improve performance by up to 30%.

Multiphysics Performance Improvements

In the multiphysics suite, all multiphysics simulation cases that use System Coupling benefit from performance improvements of 3X for the coupling engine — increasing overall run times by 20% or more. With the update, users can run mixed steady-transient analyses, which increases simulation efficiency when modeling a multiphysics application with fast physical effects on one side and a slower response on the other. The “fast” physics can be run as steady-state and the slower response as transient.

More Comprehensive and Insightful 3D Design Exploration

ANSYS® Discovery™ continues its award-winning momentum to bring simulation upfront in the design process and simulation insight to every engineer. In this release the designer use cases are expanded with live thermal stress and electrical conduction simulation.

Engineers need to evaluate a broad spectrum of product behaviors as they develop their designs, and ANSYS Discovery features industry-leading breadth of phenomena with unparalleled speed and ease of use. This release also delivers more insight from the simulations, through a new interactive legend, improved result controls and enhanced immersive interaction with 3D simulation results. While still in beta, generative design capabilities take a step forward with options for getting results back to surface-based CAD models.

Faster and Easier Additive Manufacturing

ANSYS Additive Prep, built right into ANSYS® SpaceClaim®, makes orienting parts and creating advanced support structures easy. New heat maps give fast feedback on optimal supports, distortion tendency and build time while native support generation tools are fast and easy to use.

New User Experience

ANSYS 2019 R2 introduces a new ANSYS Fluent user experience built on top of its proven solver that improves the workflow process without compromising accuracy. Engineers will benefit from the complete, single window solution within ANSYS Fluent, offering speed and simplicity at every step. The new experience streamlines the ANSYS Fluent workflow for generating a mesh from imported computer-aided designs and removes usability barriers for common tasks — enabling users to iterate faster with less training.

User-focused enhancements enable more problem-solving. Task-based workflows with parallel processing can now be used to generate Mosaic-enabled Poly-Hexcore meshes up to 10x faster so users can complete more simulations in less time.

“Mosaic technology enabled Fluent Meshing Workflow allows us to reduce the preprocessing time of our electric generator thermal simulations from six to eight days to four hours,” said Itsaso Auzmendi-Murua, research and development thermal research engineer, INDAR. “It provides us an automated and robust preprocessing tool that accelerates our thermal designs and translates into more confident predictions about the future performance of our generators.”

“Mosaic-enabled meshing technology enables us to reduce mesh size by up to 30 percent, mainly in large sizes. Mosaic, along with ANSYS’ task-based watertight meshing workflow, speeds the setup and the mesh generation process so we can create high-precision meshes faster, even in complex geometries,” said Pablo Fernandez, research and development manager at Schako Iberia. “These are the most remarkable advancements in meshing technique in recent years and we estimate that they will reduce our development time by up to 15 percent.”

New Product Line

New to the ANSYS portfolio, ANSYS Motion is the most powerful multibody dynamics (MBD) solution on the market. Developed by South Korea’s Virtual Motion, Inc., ANSYS is now making this industry-proven technology available to its global users. The third-generation MBD solver offers a full suite of dynamic capabilities for both rigid and flexible bodies. The product line features an extensive range of powerful application-based toolkits — enabling users to model complex mechanisms, including drive systems and vehicle handling, with ease.

Next-Generation Capabilities for Electronics

New offerings in the electronics and electromagnetics suite include EMI Scanner, electromigration analysis and noise-vibration-harshness (NVH) capabilities. EMI Scanner is a new feature within ANSYS SIwave and ANSYS HFSS that can quickly identify areas of potential electromagnetic interference on users’ printed circuit board designs prior to simulation — eliminating errors and speeding time to market. In ANSYS SIwave, electromigration analysis enables users to predict mean time to failure for on-chip and advanced electronic packaging structures. NVH is a new workflow that includes ANSYS Maxwell, ANSYS Mechanical and the acoustic solver coupled together through ANSYS Workbench. The workflow calculates the electromagnetic noise of a machine when it vibrates due to electromagnetic forces — producing a complete noise profile of an electrical machine within hours.

Improving Structural Analysis Efficiency

A new solver advancement significantly improves how users solve assemblies with contacts, enabling engineers to leverage high performance computing (HPC) and complete certain models more than twice as fast. ANSYS Mechanical also adds thermal compliance to its built-in topology optimization capabilities, empowering users to generate designs that maximize heat transfer.

More powerful than ever, ANSYS Mechanical accurately solves difficult, nonlinear mechanical problems. Enhancements in fatigue crack growth and nonlinear solver re-meshing to solve highly deforming geometries mean more complicated models can be solved with ease. A revolutionary thermal analysis technique uses mixed element types to reduce complexity by 5X without sacrificing accuracy, which is crucial for solving challenging electronics packaging and circuit thermal models.

Powerful Metal Additive Manufacturing Solutions

With breakthrough updates to the ANSYS Additive Suite, including a new product, ANSYS provides the most powerful simulation solution on the market for metal additive manufacturing (AM). The newly released ANSYS Additive Science delivers an exploratory environment for engineers to determine the optimum process parameters for metal AM machines and materials — helping users understand how changes to machine parameters affect meltpool sizes and material porosity. Within the existing tools, ANSYS Additive Print widens the range for supported materials and is faster with improved robustness for thin-walled structures. ANSYS Workbench Additive increases accuracy while maintaining reasonable model sizes through a new meshing option – layered tetrahedral elements – that significantly impact model fidelity in geometries with fine details.

“We help customers optimize geometries for additive manufacturing across industries, from aircraft to energy to oil and gas. Using ANSYS Additive Print to simulate how materials will behave during the printing process, we shorten the development process and reduce the cost of trial and error,” said Sven Donisi, managing director, Rosswag Engineering. “ANSYS enables our customers with more freedom to design and create new alloys with less risk.”

Enhanced Embedded Software

The embedded software suite brings new and enhanced capabilities for automotive applications, including autonomous vehicles, for multicore code generation and testing. The enhanced workflows and features empower users to design and deliver safety-critical products faster with less engineering effort and reduced cost and time to certification, regardless of industry.

Improvements to SCADE Suite for automotive applications make it simpler and faster to comply with industry standards like AUTOSAR and ISO 26262 when developing model-based systems and software for autonomous vehicles.

With new enhancements, users can reduce testing costs and speed up certification by achieving model and code coverage in a single activity. The release couples efficiency and error finding with an exclusive tool that enables users to achieve both model and code coverage for embedded software applications in just one activity.

“The latest version of ANSYS SCADE Test provides us with a number of improvements enabling huge savings in both effort and time during the testing phase of our product development process,” said Christine La Porte, flight control application software engineer, Dassault Aviation. “We will use this new version of SCADE Test for both our current and upcoming projects to enhance our time to market.”

Enabling Safer Systems

In the systems suite, ANSYS VRXPERIENCE integrates two new camera models enabling users to test the perception algorithm in night driving conditions. The new models also validate automotive systems in dangerous conditions that are complicated to reproduce in physical tests. VRXPERIENCE also includes advanced simulation of scenarios with traffic and vehicle dynamic for head lamps, sensors and HMI use cases, and the product now contains a SCADE plug-in interface allowing users to get faster rapid prototypes for lighting or ADAS control laws.

With new features in ANSYS medini analyze, users can more quickly and accurately perform functional safety analysis for DO-178C and other standards on aircraft systems. The new ISO PAS 21448 on Safety of the Intended Functionality (SOTIF), in combination with ISO 26262, addresses unreasonable risks in the absence of the malfunctions of the electric and electronic (E/E) systems in automobiles and other land vehicles. SOTIF issues are especially important for advanced driver-assistance systems and autonomous vehicle (AV) systems. New capabilities in ANSYS medini analyze enable automotive and AV users to perform SOTIF-related analysis of E/E systems.

Optical Updates

In the optical suite, ANSYS SPEOS strengthens predictive design capabilities for creating, testing and validating a virtual design in a fast iteration loop. ANSYS SPEOS also ensures compliance with international standards and regulations including SAE International, the International Electrotechnical Commission and Insurance Institute for Highway Safety. The ANSYS SPEOS Head-Up Design and Analysis add-on enables users to anticipate and simulate perception issues like blurry images at a very early development stage — drastically reducing the need for time-consuming and expensive physical prototypes.

“Oceaneering provides remotely operated vehicles to more than half of the world’s offshore oil rigs,” said Todd Newell, vice president of technology, Oceaneering. “We are developing our next-generation, autonomous vehicle using a combination of ANSYS flagship products, optical and embedded software solutions to test designs and validate algorithms for obstacle avoidance.”

Expanded Physics Capabilities in 3D Design

In the 3D design suite, ANSYS adds topology optimization to ANSYS Discovery Live – taking a leap forward in making digital exploration and generative design accessible to every engineer. Through real-time shape optimization, engineers can take their ideas to a new level by drastically reducing weight, while retaining strength and creating shapes not previously possible. These capabilities are delivered with the award-winning speed and ease of use associated with Discovery Live. ANSYS Discovery AIM expands its physics capabilities by adding a random vibration solution, a common and useful feature for engineers in the aerospace and defense industries. Engineers can now observe the likelihood of a certain displacement or stress due to excitation within a range. ANSYS Discovery SpaceClaim now includes two beta features targeted at creating and parameterizing any concept model by including sketch constraints and feature tracking.