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Home / ANSYS Release 2020 R2

ANSYS Release 2020 R2

LEAP Australia is pleased to announce the release of ANSYS 2020 R2 which is now available to ANSYS customers across Australia and New Zealand from the ANSYS Customer Portal.

Ansys 2020 R2 significantly upgrades Ansys’ next-generation engineering simulation software, HPC resources and platform solutions to power team-wide global collaboration and information sharing. The update brings enhanced solving and collaboration capabilities, key for enabling globally distributed teams to further organization-wide innovation.

Ansys 2020 R2 helps engineering teams accelerate innovation in any environment and create cutting-edge designs by harnessing new workflows and dynamic capabilities across Ansys’ flagship suites. Updates in Ansys Cloud offerings, such as virtual desktop infrastructure support, unites Ansys’ flagship simulation solutions with highly scalable compute power delivered by cloud-based high-performance computing (HPC). Platform solutions enhanced with powerful workflows deliver a streamlined user experience with enhanced functionality for data and configuration management, dependencies visualization and decision support, as well as user-friendly workflows for process integration and design optimization and materials management. Ansys’ digital twin solutions enable remote monitoring of assets and are a critical component for predictive maintenance.

Collectively, these resources will help users generate larger, more complex designs easier and faster than ever, increase productivity, spur development of high-quality products and expedite time to market.

3D Design: Rapid Design Exploration for the Next Generation of Product Design
This release introduces Ansys Discovery, the first product design software to combine instant physics, proven high-fidelity simulation and interactive geometry modeling into a single, radically easy-to-use interface.

Users can now explore large design spaces and answer critical design questions early in the product design process, without waiting days or weeks for traditional simulation results. Discovery seamlessly combines direct human-driven interaction with generative algorithms to inspire new designs — and embeds multiphysics simulation to provide both rapid and accurate product insights.

Ansys SpaceClaim updates that support concept modeling and model prep for simulation include: block recording and bidirectional CAD interfaces to allow import of modified CAD geometry; constraint-based sketching that makes it easier to create complex sketches for 3D design; and autoskinning of topology optimization results from Ansys Mechanical for automated geometry reconstruction.

Additive Manufacturing
New features in the Ansys Additive Suite enable you to add user-defined materials and import EOS build files. Also, improvements have been made to the Print to Workbench workflows for simulating cutoff, heat treatment and other advanced scenarios.

  • In Ansys Additive Science, you can now define your own material parameters. For example, penetration depth and absorptivity are required internal inputs that are generally unknown and vary based on other process parameters. With the user-defined material capability, you can examine trends and create new materials that account for these variations in absorptivity and penetration depth.
  • Ansys Additive Print includes directional cutoff using MAPDL as the solver.
  • EOS machine build files can now be imported into Additive Print.
  • Additions to Additive Prep include automatic collision checks for part-free areas, multiple supports on a single part region and the ability to export CLI files.

Electromagnetics
Ansys 2020 R2 has new capabilities leveraging streamlined electronics workflows, thermomechanical integration and advances in high-performance computing.

  • Ansys HFSS auto-computes the bio-compatibility of 5G equipment and includes an enhanced HPC 3D Component DDM solver for array antennas.
  • Ansys EMA3D Cable provides platform-level EMI/EMC cable harness analysis.
  • Ansys SIwave auto-reports signal integrity metrics and generates complex algorithmic models to confirm system performance for IC vendor selection.
  • Ansys Maxwell leverages electric motor cyclic repeatability by slice-only solving within repeated non-planar radial boundary conditions.
  • Ansys Icepak supports dynamic thermal management to auto-throttle active device characteristics based on system temperatures.
  • Ansys Lumerical introduces process-enabled custom design, improves statistical support, enhances its CML Compiler usability and provides an extended Photonic Verilog-A model library.

Embedded Software
Ansys SCADE enables safer embedded automotive software with an ISO 26262 ASIL D-certifiable, AUTOSAR RTE-compliant, code generation flow for software components. Ansys SCADE Vision improves deployment, scalability and performance of AI-based perception software testing through multi-GPU parallelization, and offers automated integration with Ansys medini analyze for the systematic identification of hazards, in compliance with SOTIF, etc.

For safer embedded avionics software, the release adds interactive ARINC 661 widgets to improve responsiveness with touch screen cockpit display systems, and supports a new qualified version of Ansys SCADE Display KCG 6.7.1 Code Generator.

A multicore-enabled formal proof engine in Ansys SCADE Suite Design Verifier improves the performance/verification of safety properties (60X). The new ALM Gateway connector to Siemens Polarion® is now integrated in all SCADE products, providing access to requirements and traceability throughout the project life cycle.

Fluids
Fluids products accelerate innovation with improved workflows, innovative features and new capabilities:

  • Workflow improvements in Ansys Fluent streamline battery simulations for CHT setup in a single panel. Fluent can also accept FMUs for ECMs, increasing electrical performance input flexibility.
  • Fluent’s new battery capacity fade model accurately predicts discharge time at high discharge rates. Battery capacity reduction can also be predicted due to calendar and cycle life from the new aging model.
  • Positive-displacement compressors can now be solved quickly and accurately in Ansys Forte with automated meshing and a refrigerant database with real-gas properties.
  • Fluent’s free shape optimization (adjoint) solver now uses the cutting edge GEKO turbulence model providing more accurate shape sensitivity.
  • A generalized two-phase (GENTOP) model significantly elevates Fluent’s multiphase regime transition offering.
  • GPU-based animations accelerate Ansys CFX transient blade row results.

Materials
Ansys 2020 R2 delivers materials information improvements to help you build better products using digitalized materials knowledge. New features include:

  • Materials data ready for simulation in more Ansys solvers: the extension of Materials Data for Simulation (MDS) to Ansys Discovery Live and Ansys Fluent comes with even more simulation-ready data for Ansys Mechanical and Ansys Electronics Desktop.
  • Materials data management integration with Creo design tools in Ansys GRANTA MI Pro, building on the existing cross-platform support for CAD and CAE with Siemens NX™ and Ansys Workbench.
  • Significantly enhanced usability in Ansys GRANTA MI Enterprise with a unified user-interface and enhanced integration to Ansys Minerva and other enterprise systems.
  • Updated versions of the latest materials datasets for restricted substances, MMPDS and ASME, together with improved integration between Ansys GRANTA Selector and GRANTA MI Pro.

These improvements will help you reach your goals of faster, more innovative digital product development through pervasive material intelligence.

Optical
Ansys 2020 R2 empowers Ansys SPEOS users to go further than ever before with enhancements that improve the handling of complex sensors, project preview and computation.

Enhancements include:

  • Highly accurate camera models drastically improve camera simulation experience
  • A new version of the SPEOS Live Preview increases accuracy, enables faster simulation times when using light sources and provides nearly real-time review
  • 4X faster simulation setup thanks to optimized GUI

Platform
Ansys Cloud has a full Virtual Desktop Infrastructure (VDI) so you can run a complete, cloud-based workflow. Ansys Mechanical, Ansys Fluent and Ansys Electronics Desktop can be run on workstation-class architecture from any computer using the VDI.

Additionally, Ansys Cloud now fully supports Ansys LS-DYNA, so you can seamlessly send your LS-DYNA solves to Ansys Cloud for additional compute power.

Ansys Minerva has the following enhancements:

  • The interactive capability to visually drill and traverse the complex digital dependencies between projects and inputs/outputs
  • Ecosystem connectors
  • Connection with Ansys GRANTA MI for materials-to-CAE traceability
  • Fully automated Ansys Spaceclaim assembly handling
  • Support for Ansys optiSLang HPC jobs

Enhancements include a new connection between optiSLang and Ansys Electronics Desktop via a wizard-based setup.

The new Deep Learning Extension adds neural networks to MOP competition to analyze very large data sets.

Semiconductors
Ansys introduces RaptorH — an electromagnetic simulation and extraction tool that is optimized for semiconductor circuits and 3D-IC packaging. Now including the Ansys HFSS electromagnetic simulation engine, RaptorH provides verification and ease-of-use for chip designers, with access to encrypted foundry technology files.

Ansys PowerArtist features static power efficiency checks as early signoff criteria to qualify RTL IP without requiring vectors. It also accelerates time-to-power for emulator-generated long-activity scenarios.

Ansys RedHawk-SC’s novel no-propagation vectorless (NPV) dynamic analysis approach identifies power grid weakness and enables greater than 90% switching coverage.

Ansys Totem’s new adaptive meshing supports large PMIC designs with a 4X–5X runtime improvement and a 20%–40% memory footprint compared to traditional solutions.

The RedHawk-SC product family is certified for FinFET nodes down to 4nm/3nm and 2.5D/3D-IC packaging technologies for multiphysics signoff.

Structures
In Ansys 2020 R2, Ansys Mechanical includes significant enhancements in advanced, intelligent, nonlinear structural solvers, with a focus on automotive, reliable electronics and improved workflows to accelerate innovation:

  • A novel contact detection technique uses a mix of nodal and gauss points to increase contact robustness.
  • For better fitting of test data to material models, a new parameter fitting capability improves matching of plasticity models used in applications such as thermomechanical fatigue.
  • The new Cycle-Jump feature reduces solve times for thermomechanical fatigue problems where plastic damage accumulates over load cycles, giving you the ability to “jump” across cycles.
  • Ansys LS-DYNA solver capabilities have been integrated into the Mechanical interface, such as smooth particle hydrodynamics (SPH) for analysis of high-speed impacts, blasts or explosions.
  • Ansys Sherlock now features trace reinforcements, enabling more accurate electronic models and meshes that consist almost entirely of hexahedral (brick) elements.
  • The Ansys GRANTA Materials Data for Simulation dataset increases the coverage of structural steels, and is now available within Mechanical.

Systems
Ansys Twin Builder makes it quicker and easier to deploy and validate your digital twins with the introduction of Ansys Twin Deployer. Twin Deployer significantly reduces deployment time and helps you easily deploy your twin using cloud, edge or offline computing resources.

Ansys VRXPERIENCE delivers key functionalities to develop and validate autonomous driving (AD) embedded software functions — from advanced lidar modeling in VRXPERIENCE Sensor, to a new sky model for enhanced daytime simulation that extends camera HiL use cases to daylight. In addition, VRXPERIENCE Driving Simulator powered by SCANeR™ provides a complete NCAP scenario kit for AD function development.

Ansys medini analyze uniquely supports best practices from AIAG- and VDA-harmonized failure modes and effects analysis (FMEA) methodology, so automotive suppliers can easily meet their FMEA requirements. This approach also provides action priorities (AP) as an alternative evaluation option and FMEA-MSR to access the system response to failures. Likewise, an FMEA extension for customizable FMEA risk parameters is now available to adapt risk matrices to your project’s requirements.

Multiphysics
For multiphysics simulations that use Ansys System Coupling, Ansys 2020 R2 brings important extensions:

  • Induction heating cases can now include transient excitation and motion.
  • After running an electrothermal simulation with Ansys Maxwell and Ansys Fluent, the volumetric temperature can be mapped from Fluent to Ansys Mechanical for stress analysis.
  • Fluid–structure interaction simulations with flow cutoff are more robust and benefit from significant numerics and stabilization improvements.
  • Stabilization is a lot easier to use and significantly improves convergence for a range of fluid–structure interaction and electrothermal cases.
  • Workflow improvements include instructive error messaging, filtering, charting and snapshots.

Ansys 2020 R1 Updates

Facing increasing demands to streamline product development life cycles and boost product performance, engineering teams in all industries require the most advanced simulation technology. For optimal performance, simulation solvers must operate seamlessly across all physics and among all members of an engineering team.

ANSYS 2020 R1 continues to integrate simulation throughout product life cycles, from ideation to virtual testing to operation, with ANSYS Minerva. This cutting-edge platform spurs collaboration within global engineering teams and increases data sharing to innovate product designs and slash development costs.

Minerva enables unprecedented access to the broadest selection of the most accurate, physics-based simulation software in the world. ANSYS 2020 R1 introduces many trailblazing enhancements to these technologies, driving unrivaled engineering productivity.

ANSYS 2020 R1 includes enhancements to ANSYS Mechanical to help engineers design complex, highly nonlinear and extremely large models. This release also features a greatly simplified workflow in ANSYS Fluent, so even novice engineers can execute complex multiphase simulations quickly and easily. Other portfolio upgrades include dynamic new tools for ANSYS HFSS SBR+ and ANSYS Maxwell that substantially improve processes for electronic/electromagnetic design.

3D Design
Explore more designs quickly in ANSYS Discovery Live with changes to the structural solver to improve accuracy for thinner geometries, and with a newly introduced steady-state fluids solver. Get upfront design insights with the addition of manufacturing constraints and multi-analysis optimization for topology optimization capabilities.

With ANSYS Discovery AIM, you can now simulate rubber components with an easy-to-use, guided workflow. Structural materials data have also been expanded to include orthotropic elasticity and simulation of composite laminates.

New autoskin features in ANSYS Discovery SpaceClaim enable you to easily combine analytic geometry with autoskinned patches during reverse engineering. In addition, new minimal surface lattices increase efficiency in additive manufacturing applications.

Additive Manufacturing
ANSYS 2020 R1 features major advances in additive manufacturing (AM) simulation capabilities throughout the AM product line:

ANSYS Additive Prep features expanded capabilities in the build processor so you can change laser parameters. Building on its capability to write files to SLM machines, it now lets you write files to EOS machines.
Workbench Additive now offers inherent strain simulation in addition to thermal–structural additive simulation. ANSYS Additive Print to Workbench Additive workflow for cutoff scenarios has been introduced.
Additive Print now supports J2 Plasticity. It also accepts laser beam inputs for the thermal solver.
Aluminum alloy AlSi10Mg has been validated for all simulation types in Additive Print and Additive Science.
Additive Print and Additive Science have been improved for increased accuracy and faster run times.

Electromagnetics
ANSYS 2020 R1 delivers electromagnetic field simulation solutions to aid our customers’ pursuit of the engineering megatrends of autonomy, 5G connectivity, electrification and energy efficiency. New features include:

ANSYS HFSS SBR+ offers creeping wave physics for installed antenna analysis and placement studies, thus increasing the accuracy of modeling antennas integrated into objects with curved attributes.
EMI Xplorer in ANSYS SIwave helps to assess and mitigate potential board- and package-level EMI problems prior to running simulations early in the design cycle.
ANSYS Maxwell enables harmonic force coupling, enhancing the accuracy of the electromagnetic and vibroacoustic design of electric vehicle powertrains, transformers, turbomachinery and other electric machines.
ANSYS Cloud has been extended in ANSYS Electronics Desktop to include electrothermal simulations involving ANSYS Icepak. Additionally, Icepak supports steady-state or transient thermal analysis for a variety of low- and high-frequency applications.

Embedded Software
In ANSYS 2020 R1, ANSYS SCADE further accelerates the design and automatic code generation of ISO 26262 ASIL D-compliant automotive embedded control software. ANSYS SCADE Suite delivers a user-friendly interface in the SCADE Suite diff module, enhancements to the Simulink® importer and new features for multirate and multicore designs. ANSYS SCADE Test now performs interval checking and speeds up robustness testing, and ANSYS SCADE Vision quickly detects fragilities in autonomous vehicle (AV) perception software by finding edge cases.

Most of these SCADE innovations are also applicable and accessible to aerospace and defense software designers and developers. They help shorten the time to certification of DO-178C embedded control software — at the highest levels of safety. The new release continues to streamline embedded avionics cockpit display system software design and workflow integration, offering comprehensive coverage of the ARINC 661 standard.

Fluids
ANSYS Fluent offers a new experience that enables novice or expert users to run robust computational fluid dynamics (CFD) simulations in less time and with less training than ever before. Easy-to-use, task-based meshing workflows and Mosaic technology — coupled with Fluent’s CFD solvers — deliver great results, without compromise.

Easier to use
A streamlined workflow facilitates multiphase simulation setup. A single, tabbed panel organizes setup into a logical, step-by-step flow. In a benchmark gas–liquid pipe flow simulation, the new setup proved 25% faster.

More CFD solutions
An algebraic interface area density (AIAD) model accurately simulates complex multiphase regime transitions.
A detailed electrochemistry model optimizes lithium-ion battery cells.
Harmonic analysis in ANSYS CFX is 2X faster and can now solve for multiple base frequencies.
Complex fluid-structure interaction problems can be set up and solved faster and more easily.

Materials
Accurate materials information is essential for any product development organization, particularly one aiming to make pervasive use of simulation. In ANSYS 2020 R1, ANSYS GRANTA MI has an enhanced user experience, which supports the rollout of the gold standard corporate materials information management system across large engineering enterprises. With GRANTA MI, you can ensure consistency, lower risk, increase efficiency and drive innovation.

A new product, ANSYS GRANTA MI Pro, is an easy-to-implement, focused version of GRANTA MI, designed as a fast-start option for design and simulation teams. This product provides CAD and CAE users with direct access to reliable materials reference data from ANSYS Granta, alongside managed lists of in-house materials and their approved properties.

ANSYS 2020 R1 also enhances the data in the GRANTA Materials Data for Simulation dataset, available within ANSYS Mechanical and ANSYS Electronics Desktop.

Optical
In this release, ANSYS SPEOS delivers:

Enhanced realism with a texture mapping feature that reproduces materials properties and behaviors in a dedicated environment
A new capability that strengthens the connection between SPEOS and CAD, and enables instant geometry updates to boost productivity and accelerate geometry analysis
Expanded sensor simulation capabilities for greater accuracy of advanced driver-assistance systems (ADAS) and autonomous driving (AD) simulations
A new lens system importer that protects the intellectual property (IP) of image systems imported into SPEOS
New design features that account for manufacturing constraints to avoid downstream production issues
In addition, SPEOS Live Preview now supports camera sensors and delivers a live preview of camera-captured raw footage.

Platform
ANSYS Minerva improves the organization of product life cycle data. It facilitates version control, 3D visualization, collaboration and data reuse. New integration with high-performance computing (HPC) systems and CAE tools streamlines process challenges. The new release incorporates enhancements to dashboards, configuration management, metadata handling, the ANSYS Workbench client connector and job submission workflow, and project updating in ANSYS optiSLang.

Semiconductors
To meet the growing demand for increased signoff coverage for next-generation, ultra-large and high-performance system-on-chips (SoCs) driving AI, 5G and automotive applications, ANSYS’ semiconductor portfolio of power and reliability solutions has been enhanced to drastically improve scenario coverage and accelerate time to results.

ANSYS PowerArtist features static power efficiency checks that serve as early signoff criteria to qualify RTL IP without requiring vectors and accelerates time-to-power for emulator-generated long activity scenarios. ANSYS RedHawk-SC’s novel no-propagation vectorless (NPV) dynamic analysis approach efficiently identifies power grid weakness in the absence of simulation vectors and enables a more than 90% switching coverage. ANSYS Totem’s new adaptive meshing algorithm supports large PMIC designs with a 4X–5X runtime improvement and a 20–40% memory footprint compared to traditional FEM solutions, while providing silicon-correlated accuracy.

The Totem and RedHawk product family is also certified for a comprehensive list of FinFET nodes down to 4nm/3nm process technology and 2.5D/3D-IC packaging technologies for multiphysics signoff across major foundries.

Structures
ANSYS 2020 R1 empowers ANSYS Mechanical users to go further than ever before with enhancements to improve the handling of complex, highly nonlinear and massively large models. Enhancements include:

Additional functionality directly in Mechanical for streamlined workflows, including cross sectional assignments for line bodies, post-processing of reinforcements and easy drag-and-drop external models
Improved topology optimization validation workflows so you can now go directly from a tessellated optimal shape to meshing and validation of the final design
Full migration of ANSYS AQWA, a hydrodynamic analysis tool, into Mechanical, including new technology such as the ability to transfer generated loads to other analysis systems
Enhanced integration of LS-DYNA into the ANSYS Mechanical interface following our recent acquisition of LSTC
Quicker solve times in ANSYS Sherlock, which now uses ANSYS MAPDL as its default FEA engine, along with consolidation of application settings and the ability to configure multiple part libraries

Systems
ANSYS 2020 R1 contains two new systems solutions: ANSYS VRXPERIENCE Light Simulation and ANSYS medini analyze for Cybersecurity, along with a new Battery Wizard in ANSYS Twin Builder.

VRXPERIENCE Light Simulation makes the illumination of automotive product designs easier. It combines visual design and advanced engineering review by connecting Autodesk VRED design visualization software and ANSYS’ physics-based lighting simulations. The result is a photorealistic visualization of vehicle interior and exterior lighting.

ANSYS medini analyze for Cybersecurity provides systematic analysis and assessment of security threats to cyber–physical systems, starting early in the design stage. medini analyze also supports safety analysis of the intended functionality (SOTIF) of systems, which makes autonomy (autonomous vehicles, air taxis, etc.) possible.

With the ANSYS Twin Builder Battery Wizard, you can easily construct battery cells and assemble them into battery modules. It also streamlines model creation and parameterization of ECM cells and modules.

Detailed information on the ANSYS 2019 release can be found here.