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Home / Electronics Reliability

Electronics Reliability

Optimise and Predict Electronics Reliability

Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.

  • Extract Detailed Geometries from any ECAD file
  • Perform Complex Multiphysics Analyses
  • Predict Time to Failure Before Prototyping
  • Implement Automation and Optimisation

Electronics Reliability Just Got Easier

Design Democratization
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.

Robust Reliability Predictions
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.

Workflow Automation
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.

Electrical, Thermal and Mechanical Analysis
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.

“Across the board, it doesn’t matter what tech trend you’re looking at – 5G, electrification, AVs, IIoT – PCB reliability is at the backbone of all those needs.”

Carlos Gomez
LEAP Application Engineer
Ansys Icepak

Featured Products

Sherlock

Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design.

Icepak

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Mechanical

Solve broad structural analysis needs with a suite of finite element analysis (FEA) solutions that provides in-depth analysis of structural and coupled-field behaviours.